Technology Development
| Item | Unit | 2023 | |
|---|---|---|---|
| Model | Batch Production | ||
| Laminate suppliers | EMC，NAN YA，SHENGYI ITEQ | ||
| Laminate type | Mid Tg / High Tg / BT-like / Normal Dk / Low Dk / Low loss | ||
| Laminate Tg | Tg150 /Tg170 /Tg180 | ||
| Min core thickness | mm | 0.05 | 0.05 |
| Min Prepreg style | mm | 1017 | 1017 |
| Min board thickness (10-layer HDI) | mm | 0.62 | 0.65 |
| Min board thickness (12-layer HDI) | mm | 0.72 | 0.75 |
| HDI type | 1+N+1 ~ 14 ELIC | ||
| mechanical drilling | unit | ||
| Min Hole Diameter | mm | 0.15 | 0.2 |
| Min annular ring | mm | 0.075 | 0.01 |
| Laser drilling | unit | ||
| Min Hole Diameter (CO2) | mm | 0.05 | 0.075 |
| Min annular ring | mm | 0.05 | 0.056 |
| Min line width / spacing | unit | ||
| Innerlayer (core) | um | 40/40 | 40/50 |
| Secondary outerlayer / outerlayer (Cu plating layer) | 40/50 | 45/50 | |
| Impedance | unit | ||
| Impedance tolerance | ohm | ≥50ohms，±8% < 50ohms，±4ohm | ≥50ohms，±10% < 50ohms，±5ohm |
| Solder mask/Surface treatment | unit | ||
| Soldermask registration | mm | 0.025 | 0.0375 |
|
Min soldermask bridge (working draft) |
mm | 0.05 | 0.064 |
| item | unit | 2023 | |
|---|---|---|---|
| Model | batch production | ||
| Base material supplier | DOOSHAN，THINFLEX，ITEQ，SHENG YI | ||
| type | Halogen-free | ||
| Laminate Tg | TG150，TG170 | ||
| Min board thickness (Double-sided) | mm | 0.1 | 0.12 |
| Coverlay supplier | DONGYI，OMAR，SHENG YI | ||
| PP | DOOSHAN，WAZAM，SHENG YI | ||
| Min board thickness(Rigid-flex) | mm | 0.3 | 0.33 |
| mechanical drilling | unit | ||
| Min Hole Diameter | mm | 0.1 | 0.15 |
| Min annular ring | mm | 0.075 | 0.1 |
| Laser drilling(UV) | unit | ||
| Min Hole Diameter | mm | 0.04 | 0.05 |
| Min annular ring | mm | 0.05 | 0.075 |
| Laser drilling (CO2) | unit | ||
| Min Hole Diameter | mm | 0.07 | 0.08 |
| Min annular ring | mm | 0.05 | 0.05 |
| Min line width / spacing | unit | ||
| Inner layer (whole panel) | um | 40/40 | 45/45 |
| plating layer (whole panel) | um | 40/50 | 50/50 |
| impedance | unit | ||
| impedance | ohm | ±8% | ±10% |
| Soldermask/Surface finish | unit | ||
| Solder mask registration | mm | 0.03 | 0.04 |
| Min Solder mask Bridge | mm | 0.06 | 0.075 |
| Solder mask color | green,blue,black,yellow | ||
| Surface finish | ENIG，ENIG+OSP，ENEPIG，OSP | ||
