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Technology advances, and consumers yearn for electronic products with better portability, more functions and higher speed. Electronic products are getting even miniature, lighter, thinner and more intelligent. They are packed with more functions. To adapt for these requirements, printed circuit boards (PCBs) are moving to high-density interconnect (HDI), which achieves higher wiring density and finer lines of PCB through blind /buried via connection technology. The size of HDI board is is getting smaller, yet it realizes higher wiring density. Red Board mainly delivers 1+N+1, 2+N+2, 3+N+3 and anylayer (every layer inter-connected, ELIC). The minimum line width /line spacing is 0.04mm/0.04mm.
Flexible Printed Circuits (FPCs) build circuit patterns by image transfer and etching processes on flexible copper cladded laminate (FCCL). The outer layers and inner layers of double-sided and multi-layer FPCs are connected through direct metallization of drilled holes. The base material of FCCL, adhesive layers and coverlay are polyimide (PI). Red Board produces single-sided, double-sided and multi-layer FPCs.
Rigid-flexible circuit (Rigid-flex) is a printed circuit board that combines the merits of rigid PCB and FPC. It is used to achieve miniaturization and bendable to save spacing. No connectors are needed for its connection and this board can be boned to complex sub-assemblies.
Red Board's Rigid-flex products are used on battery protection boards, camera modules and mobile phones, etc.
Conventional printed circuit boards build circuit patterns on copper cladded laminates (CCL) and their electrical connectivity between layers are achieved through via holes. After long-term development, the process technology has evolved from single-sided PCB to double-sided and multi-layer circuit boards. Red Board mainly produces 2 to 32 layers multi-layer PCB, with a maximum copper thickness of 6Oz for innerlayer and outerlayer. Our surface finish technology includes lead-free HASL, ENIG, immersion silver, immersion tin, OSP, ENEPIG, gold fingers, etc.
As a base board used to accommodate bare chips, IC substrate is used to support, secure and protect the IC chip and it also provides thermal dissipation tunnels. There are wires inside the IC substrate for electrically connecting the chip and the printed circuit board, so it is an intermediate product for linking up chips and PCB. IC Substrate demands finer traces, smaller pads and holes, higher wiring density, greater pin numbers, more compact volume and ultra-thin core. Precise inter-layer alignment, pattern imaging, electrolytic plating, drilling and surface treatment are essential to the manufacturing of IC substrates.
